ИСТИНА

Significant attention is paid to the electrodeposition of metals from ionic liquids (ILs) and deep eutectic solvents (DESs). ILs are characterized by unique properties, such as chemical, thermal, and electrochemical stability, non-volatility, and high ionic conductivity, which makes them a good alternative for replacing aqueous electrolyte solutions. DESs of third type (a mixture of quaternary ammonium salts with hydrogen bond donors, HBDs) are similar in properties to ILs, but have advantages over them, such as ease and low cost of synthesis, non-toxicity, and biodegradability. The initial stages of Cu electrodeposition from aqueous solutions (UPD, nucleation, and deposit growth) have been thoroughly studied. Therefore, copper deposition is a good model process for studying the metal deposit nucleation and growth in ILs and DESs. Here we study the electrodeposition of copper from DESs based on choline chloride and different HBDs, such as urea, ethylene glycol and diethylene glycol on polycrystalline and single-crystalline Pt and Au electrodes.