ИСТИНА

Significant attention is paid to the electrodeposition of metals from ionic liquids (ILs) and deep eutectic solvents (DESs). ILs are characterized by unique properties, such as chemical, thermal, and electrochemical stability, non-volatility, and high ionic conductivity, which makes them a good alternative for replacing aqueous electrolyte solutions. DESs of the third type (a mixture of quaternary ammonium salts as hydrogen bond acceptors, HBAs, with hydrogen bond donors, HBDs) are similar in properties to ILs, but have advantages over them, such as ease and low cost of synthesis, non-toxicity, and biodegradability. The underpotential (UPD) and overpotential (OPD) deposition of Cu from aqueous solutions have been thoroughly studied. Therefore, copper deposition is a good model process for studying the metal deposit nucleation and growth in ILs and DESs.