Advanced Physics Researchжурнал

Статьи, опубликованные в журнале

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• • 2025 Enhancing Signal Purity in Josephson Structure Measurements
  • Nazhestkin Ivan A., Gubochkin Georgy I., Shvartzberg Jonathan, Rajan Sai-Prasad M., Egorov Sergey V., Gurtovoi Vladimir L., Ryazanov Valery V., Stolyarov Vasily S., Yakovlev Dmitry S.
  • в журнале Advanced Physics Research, издательство Wiley-VCH Gmbh (Weinheim, Germany) DOI
• • 2025 Focused Xe-Ion Plasma Beam Milling of Coumarin-153 Single Crystals Into Photonic Cavities–Experimental and Theoretical Investigations
  • Chosenyah Melchi, Pradeep Vuppu Vinay, Novikov Vladimir, Goud R.Sai Prasad, Murzina Tatiana, Chandrasekar Rajadurai
  • в журнале Advanced Physics Research, издательство Wiley-VCH Gmbh (Weinheim, Germany), с. 2500013 DOI
• • 2024 Topological Insulator Nanowires Made by AFM Nanopatterning: Fabrication Process and Ultra Low‐Temperature Transport Properties
  • Yakovlev Dmitry S., Frolov Aleksei V., Nazhestkin Ivan A., Temiryazev Alexei G., Orlov Andrey P., Shvartzberg Jonathan, Dizhur Sergey E., Gurtovoi Vladimir L., Hovhannisyan Razmik, Stolyarov Vasily S.
  • в журнале Advanced Physics Research, издательство Wiley-VCH Gmbh (Weinheim, Germany) DOI
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  • 2024 Topological Insulator Nanowires Made by AFM Nanopatterning: Fabrication Process and Ultra Low‐Temperature Transport Properties
  • Yakovlev Dmitry S., Frolov Aleksei V., Nazhestkin Ivan A., Temiryazev Alexei G., Orlov Andrey P., Shvartzberg Jonathan, Dizhur Sergey E., Gurtovoi Vladimir L., Hovhannisyan Razmik, Stolyarov Vasily S.
  • в журнале Advanced Physics Research, издательство Wiley-VCH Gmbh (Weinheim, Germany) DOI
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  • 2023 Terahertz Spectral Signatures of Ultrafast Spin Transports in Ferromagnetic Heusler Alloy
  • Zuanming Jin, Guo Yingyu, Peng Yan, Zhang Zeyu, Pang Jinyi, Zhang Zongzhi, Liu Fan, Ye Bin, Jiang Yexin, Ma Guohong, Zhang Chao, Balakin Alexey V., Shkurinov Alexander P., Zhu Yiming, Zhuang Songlin
  • в журнале Advanced Physics Research, издательство Wiley-VCH Gmbh (Weinheim, Germany), том 2, № 2, с. 2200049 DOI