Surface State of Sacrificial Copper Electrode by Electropolishing in Hydrophobic Ionic Liquid 1-Butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imideстатья
Статья опубликована в высокорейтинговом журнале
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Дата последнего поиска статьи во внешних источниках: 26 марта 2017 г.
Аннотация:Anodic dissolution of natural surface-oxidized, air-annealed, cathodically reduced, and cathodically deposited copper in hydrophobic ionic liquid 1-buthyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide under galvanostatic conditions by means of gravimetric measurements was studied. The resulting samples were mirror-like oxide-free copper pattern. The mechanism of the electropolishing of oxidized copper surface was considered. The consequent anodic reactions Cu2O – 1e = Cu+ + CuO, CuO – 2e = Cu2+ + O, and Cu – 1e = Cu+ take place. The electropolishing itself occurs over oxygen-free copper surface due to competitive residual water discharge in the pits and copper dissolution on the roughness.