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Статьи в журналах
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- 2010 Collimated aerosol beam deposition: sub-5-μm resolution of printed actives and passives
- Schulz D.L., Hoey J.M., Thompson D., Swenson O.F., Han S., Lovaasen J., Dai X., Braun C., Keller K., Akhatov I.S.
- в журнале IEEE Transactions on Advanced Packaging, издательство Institute of Electrical and Electronics Engineers (Piscataway, NJ, United States), том 33, № 2, с. 421-427 DOI
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- 2008 Printed silicon as diode and FET materials - Preliminary results
- Han S., Dai X., Loy P., Lovaasen J., Huether J., Hoey J.M., Wagner A., Sandstrom J., Bunzow D., Swenson O.F., Akhatov I.S., Schulz D.L.
- в журнале Journal of Non-Crystalline Solids, издательство Elsevier BV (Netherlands), том 354, № 19-25, с. 2623-2626
Статьи в сборниках
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- 2010 Electrospun a-Si using liquid silane/polymer inks
- Schulz D.L., Hoey J.M., Smith J., Lovaasen J., Braun C., Dai X., Anderson K., Elangovan A., Wu X., Payne S., Pokhodnya K., Akhatov I., Pederson L., Boudjouk P.
- в сборнике IDW'10 - Proceedings of the 17th International Display Workshops, том 3, с. 1915-1918